SEMCO Technologies is present in the semiconductor market since 1986 and has extensive experience in engineering and manufacturing of horizontal and vertical mass-production furnaces for atmospheric and reduced-pressure processing as well as wafer transport automation and software control.
The company’s field of competence covers diffusion, oxidation, LPCVD and PECVD. Typiocal applications include LYDOP POCL3 and BCl3 Diffusion, LYTOX Wet and Dry Oxidation, Anneal, Silicon Nitride, Silicon Oxinitride, Poly Silicon and TEOS. To address the challenges attached to scaling from lab scale R&D to pilot line and volume manufacturing, SEMCO Technologies proposes the MINILAB platform, an offsite process development and qualification tool covering the complete range of above-named applications. In addition to procurement, commissioning and servicing works, SEMCO Technologies is at your side accompanying your research or production operations and providing process consulting services and upgrades, training programs as well as machine refurbishments and relocations. Last but not least, our application laboratory’s team, with its wealth of process technology know-how, underlines our philosophy to offer premium services to the semiconductor and microelectronics industry. SEMCO Technologies scientists and field engineers are dedicated to helping our customers and users to get the best from their investment in capital equipment and will help you to provide additional information and support.
SEMCO MEMS processing tools are used in the design and fabrication of micro-electro-mechanical systems (MEMS) sensors.
MEMS products - the most well known are the accelerometers and gyroscopes used in inertial sensing applications, such as indicators to control the deployment of vehicle airbags or into the WII remotes – are used in addition to electronic circuits and their elaboration processes are similar to those used in semiconductor materials processing. Our product offerings focus on surface micromachining involving depositing, oxidizing and annealing of silicon layers, and is mainly intended for university laboratories and MEMS R&D facilities.